2-5-13-4F Nakagawa-Chuo Tsuzuki-ku Yokohama Kanagawa 224-0003 Japan
Phone : +81-45-590-3838
E-mail : sales@tpt-japan.com

Products

Tabletop Semiautomatic / manual wire bonder
This is very flexible and precise tabletop wire bonding machine.
TPT offers both wedge and ball bonding possibilities without changing bond head.
Also easy operation is great feature of TPT, so this is best solution for R&D.
TPT : http://www.tpt.de/

Trade Show Information

Nepcon Korea
Seoul
11.-13. April 2012

SMT Hybrid Packaging
Nuremberg, Germany
08.-10. May 2012